Pamäťový modul Silicon Power DDR3L 8GB 1600MHz SO-DIMM 204-pinový 1,35V CL11

Silicon Power DDR3L 8GB 1600MHz SO-DIMM memory module designed for laptop use. This single 8 GB unbuffered DDR3L module fits 204-pin SO-DIMM slots, operates at 1.35 V and runs at 1600 MHz with CAS latency 11. It does not support ECC and is provided as a single 512M x 8 configuration suitable for upgrading or replacing laptop RAM to improve multitasking and general system responsiveness.

Advantages

The module offers low-voltage operation (1.35 V) for reduced power consumption compared with standard DDR3, a compact SO-DIMM form factor compatible with most laptops that accept DDR3L memory, and a 1600 MHz clock speed with CL11 timing for balanced performance. Being an unbuffered single 8 GB stick, it is simple to install and suitable for typical consumer notebook upgrades.

Suitable for

• Upgrading laptop memory to 8 GB capacity
• Replacing a faulty or incompatible 204-pin SO-DIMM DDR3L module
• Improving multitasking and application responsiveness on notebooks that support DDR3L 1600 MHz

Key specifications

• Capacity: 8 GB (single module)
• Memory type: DDR3L (low voltage)
• Form factor: 204-pin SO-DIMM
• Speed: 1600 MHz
• CAS latency: CL11
• Voltage: 1.35 V
• Module configuration: 512M x 8
• Buffered: Unregistered (unbuffered)
• ECC: No

How to use

Power off the laptop and disconnect any power source. Open the memory compartment according to the laptop manufacturer’s instructions, locate the 204-pin SO-DIMM slot, and carefully insert the module at a slight angle until the retaining clips engage. Close the compartment, reconnect power, and start the system. Verify that the operating system and BIOS/UEFI recognize the new 8 GB module and confirm the memory runs at the expected voltage and frequency.

Recommendations

Check the laptop’s documentation to ensure compatibility with DDR3L 1.35 V modules and maximum supported memory per slot. For dual-channel operation, install matching modules in paired slots (same capacity, speed, and timings). Handle the module by its edges and avoid touching contacts.