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Tepelný modul HP M46735-001 pre notebook HP 14 – náhradná chladiaca jednotka

Tepelný modul HP M46735-001 pre notebook HP 14 – náhradná chladiaca jednotka
Tepelný modul HP M46735-001 pre notebook HP 14 – náhradná chladiaca jednotka
148,20 €
Thermal Module HP M46735-001 for HP 14 laptop – replacement cooling assembly is a direct-fit thermal assembly designed to replace a worn or damaged cooling unit in compatible HP 14 notebooks. It includes the heat pipe, heatsink plate and contact surfaces required to transfer heat away from the proce... Čítať viac
Sklad Nie je skladomNie je skladom Kód 2445471 Značka HP Model M46735-001 Záruka 2 roky

Doprava a vrátenie tovaru

Thermal Module HP M46735-001 for HP 14 laptop – replacement cooling assembly is a direct-fit thermal assembly designed to replace a worn or damaged cooling unit in compatible HP 14 notebooks. It includes the heat pipe, heatsink plate and contact surfaces required to transfer heat away from the processor and nearby components, restoring effective thermal conduction and dissipation to maintain stable operating temperatures during normal workloads.

Advantages

This replacement cooling assembly restores the original thermal path and heat dissipation efficiency without modifying the laptop chassis. The unit is designed for OEM fit and alignment, providing correct contact pressure and surface coverage for reliable heat transfer. Using a purpose-built thermal module reduces the risk of thermal throttling and system instability compared with degraded or improvised cooling solutions.

Suitable for

  • Repairing or replacing a damaged or failed cooling module in HP 14 series laptops
  • Service and refurbishment of used HP 14 notebooks to restore original cooling performance
  • Maintenance tasks where the original thermal assembly must be replaced after disassembly

Key specifications

  • Form factor: compact laptop thermal module with integrated heat pipe and heatsink plate
  • Compatibility: designed for HP 14 series notebook models requiring this specific cooling assembly layout
  • Materials: metal heat pipe(s) and aluminum or copper heatsink surfaces for thermal conduction
  • Mounting: screw and bracket mounting points matching OEM chassis locations
  • Thermal interface: factory-compatible contact surfaces intended for use with thermal paste or pads at mating surfaces

How to use

Power down the laptop, remove the battery if applicable, and open the service access panel following the manufacturer service manual or disassembly guide. Remove the existing cooling assembly by unscrewing the mounting screws and disconnecting any fan or sensor cables as required. Clean the processor and contact surfaces with appropriate solvent to remove old thermal compound. Position the replacement thermal module so that mounting points and contact surfaces align with the processor and chassis, apply fresh thermal paste or pads to the CPU and other contact areas, then secure the assembly with the original screws and reconnect any cables. Reassemble the laptop and test system operation and temperatures under typical load to confirm correct installation.

Recommendations

Use recommended thermal paste or pads and follow torque specifications for mounting screws where available. Verify compatibility with your exact HP 14 model before purchase and perform a controlled thermal test after installation to ensure proper heat dissipation. If you are not experienced with laptop repair, consider professional installation to avoid damage to delicate components.

Hlavné vlastnosti
  • Repairing or replacing a damaged or failed cooling module in HP 14 series laptops
  • Service and refurbishment of used HP 14 notebooks to restore original cooling performance
  • Maintenance tasks where the original thermal assembly must be replaced after disassembly
  • Form factor: compact laptop thermal module with integrated heat pipe and heatsink plate
  • Compatibility: designed for HP 14 series notebook models requiring this specific cooling assembly layout
  • Materials: metal heat pipe(s) and aluminum or copper heatsink surfaces for thermal conduction
  • Mounting: screw and bracket mounting points matching OEM chassis locations
  • Thermal interface: factory-compatible contact surfaces intended for use with thermal paste or pads at mating surfaces
Parametre
Kompatibilita so značkou
HP
Množstvo v balení
1 pc(s)
Typ
Heatsink
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