Teplovodivá pasta EVGA FROSTBITE 2 chladičová pasta 2,5 g, sivá, -40–180 °C

EVGA FROSTBITE 2 heatsink compound is a grey thermal paste supplied in a 2.5 g tube designed to improve thermal transfer between processors, graphics chips and their cooling solutions. With a specific gravity of 3 g/cm³ and an operating temperature range from -40 °C to 180 °C, this small-quantity formula is aimed at precise application where only a modest amount of compound is required. The paste is compatible with common cooling assemblies for CPUs, GPUs and compact electronic components.

Advantages

The compound’s dense formulation and narrow tube packaging allow controlled, accurate application on small surfaces and fine heat sources. Its operating temperature range covers common cooling scenarios for both low-temperature standby and elevated load conditions. The grey colour aids visual placement during application, and the 2.5 g size reduces waste when only a limited quantity is needed.

Suitable for

• Thermal interface between CPU and heatsink in small builds or single-use repairs
• GPU die to cooler applications on desktop or compact systems
• Thermal contact for small electronic components and modules
• Situations requiring precise, low-volume application of thermal compound

Key specifications

• Net weight: 2.5 g
• Colour: grey
• Specific gravity: 3 g/cm³
• Operating temperature range: -40 °C to 180 °C

How to use

Clean both mating surfaces thoroughly to remove old compound, dust and oils using isopropyl alcohol or manufacturer-recommended cleaners. Apply a small, controlled amount of EVGA FROSTBITE 2 to the centre of the die or processor surface and mount the cooler, allowing the pressure to spread the compound into a thin, continuous layer. For GPU or component applications with limited surface area, use a fine-point application technique to place only the required quantity. Reassemble the cooling assembly and verify even contact and secure mounting.

Recommendations

Store the tube in a cool, dry place and reseal after use to prevent drying. Use a minimal amount to achieve full coverage without excess squeeze-out; excessive compound can impede mounting or escape onto surrounding components. Replace thermal paste during scheduled maintenance or if thermal performance degrades.