DIMM 64 GB DDR5-6000 (2x 32 GB) Dual-Kit, operačná pamäť čierna, AX5U6000C3032G-DTLABBK, Lancer Blade, INTEL XMP, AMD EXPO

LANCER BLADE DDR5 delivers compact, efficient memory performance designed for smaller PC builds. The module features a low-profile heatsink that fits into tight cases and avoids interference with tower CPU coolers. Built-in power management and on-die ECC provide stable operation, while high-quality ICs and PCB construction support reliable overclocking. The module supports AMD EXPO and Intel XMP 3.0 for simplified profile-based tuning.

Advantages

The low-profile heatsink enables installation in compact systems without obstructing large CPU coolers. Integrated Power Management IC (PMIC) improves power delivery stability and contributes to lower operating voltage compared to DDR4. On-die ECC corrects errors in real time to enhance reliability. High-quality components and PCB construction support sustained performance and overclocking. Compatibility with AMD EXPO and Intel XMP 3.0 simplifies memory tuning across modern platforms.

Suitable for

• Compact and small-form-factor PC builds
• Gaming systems requiring stable DDR5 performance
• Users who need reliable overclocking with profile support
• Workstations and systems where memory stability is important

Key specifications

• Memory type: DDR5
• Low-profile heatsink design for small cases
• Built-in Power Management IC (PMIC)
• On-die ECC for real-time error correction
• Support for AMD EXPO and Intel XMP 3.0

How to use

Install the LANCER BLADE DDR5 module into a compatible DDR5 DIMM slot on the motherboard, ensuring correct orientation and secure seating. Enable AMD EXPO or Intel XMP 3.0 in the motherboard firmware to apply optimized frequency and timing profiles; this removes the need for manual BIOS tuning. For systems without profile support, configure memory settings manually in BIOS according to motherboard and CPU guidance.

Recommendations

For best results, use the module in systems with DDR5-compatible motherboards and firmware that support AMD EXPO or Intel XMP 3.0. Ensure adequate case airflow to maintain stable temperatures, and follow motherboard vendor guidance when applying overclocking profiles.