ARCTIC TP-3 Premium Performance tepelná podložka 120 x 20 mm, 1,5 mm

High Performance - very soft

Based on silicone and a special filler, TP-3 also outperforms high-performance pads, especially when height differences of closely spaced chips typically occur due to manufacturing tolerances. The TP-3 offers excellent thermal conductivity despite extremely low hardness.

Minimization of thermal resistance

The thinner the pad, the lower the termal resistance. The TP-3 pad with a thickness of 0.5 mm can easily be compressed to 0.3 mm and thus compensate for height differences between various components of up to 0.2 mm. Please note that due to the extremely low hardness, the installation of the 0.5 mm pad requires extra care. Please refer to the user manual.

Versatile Applications

Heat-conducting, vibration-damping, mouldable, electrically insulating - safe and easy to use. Thanks to its good compression properties, the soft heat conduction pad is particularly gentle on components and at the same time a good heat conductor. In addition to the standard format for M.2, the TP-3 is available in various sizes and thicknesses, which can be easily cut to the desired shape and size. This makes it ideal for RAMs, chipsets and ICs of all kinds, which are used in PCs, laptops, consoles, graphics cards and electronic devices in general.

Safe handling

The ARCTIC TP-3 is electrically insulating, non-adhesive and easy to handle. This means that optimal and safe heat transfer can be ensured in many application areas.

Bridging gaps

The TP-3 are softer than conventional pads and therefore particularly suitable for different chip heights and possible tolerances. Thanks to their good compressibility properties, the thermal pads act as the perfect gap filler and bridges uneven surface and air gaps without stressing sensitive and protruding components.

Available in different thicknesses and sizes

Our thermal pads are available in a choice of 0.5 mm, 1.0 mm and 1.5 mm. The 0.5 mm variant is ideally suited as an alternative to heat-conducting foil. The pads are available in different dimensions, depending on their thickness. If required, the pads can also be independently cut to any size.

How to use

Measure the area to be thermally connected and cut the thermal pad to the required shape and size if necessary. Remove protective liners from both sides of the pad and place it between the component and the heatsink, ensuring full contact without air gaps. Apply even pressure to seat the pad; no curing or special tools are required. If repositioning is needed, lift gently and reapply a new pad if the original shows deformation.

Recommendations

For optimal performance, choose the correct pad thickness for the gap you need to fill and avoid stretching the pad during installation. Store unused pads in a cool, dry place away from dust and direct sunlight. Do not use thermal pads as an electrical insulator unless the product specifications state dielectric properties.