Gelid GP-Extreme tepelná podložka TP-GP01-B, 120x120x1,0mm, 12 W/mK, sivá

Premium thermal pad delivering an exceptional 12 W/mK conductivity for efficient heat transfer between components and heatsinks. The Gelid GP-Extreme TP-GP01-B ensures reliable thermal bridging for GPUs, CPUs, VRMs, SSDs, chipsets, and memory modules, maintaining optimal cooling under load.

Advantages

Ultra-high thermal conductivity of 12 W/mK rivals many thermal pastes while offering the convenience of a pad. Its silicone-based formulation is non-electrically conductive, eliminating short-circuit risks. With a wide operating range from -60°C to 220°C and UL 94 V-0 flammability rating, it remains stable in extreme conditions. The soft 35 Shore C hardness conforms to uneven surfaces, filling microscopic air gaps for optimal heat transfer.

Suitable for

• Graphics cards (GPU core, VRAM, VRM)
• Processors (CPU) and chipsets
• M.2 SSDs and memory modules
• Any application requiring a 1.0mm thick thermal interface

Key specifications

• Thermal Conductivity: 12 W/mK
• Dimensions: 120 x 120 x 1.0 mm
• Material: Silicone-based, non-electrically conductive
• Hardness: 35 Shore C
• Operating Temperature: -60°C to 220°C
• Flammability Rating: UL 94 V-0
• Dielectric Strength: 9.8 kV/mm
• Volume Resistivity: 1.0 x 10^12 Ohm-cm
• Tensile Strength: 2.5 kgf/cm²
• Elongation: 100%
• RoHS Compliant

Recommendations

For best results, ensure both contact surfaces are clean and free of dust or oils. Cut the pad slightly larger than the component, then apply firm, even pressure when mounting the heatsink. Store unused pad in a cool, dry place.