HTVRONT sublimačná páska 20 mm x 33 m modrá tepelne odolná polyimidová

Heat resistant polyimide tape for sublimation, heat press, 3D printing, electronics and soldering. Withstands temperatures up to 260 °C while leaving no residue after removal.

Advantages

High-temperature silicone adhesive bonds firmly during pressing and peels away cleanly. The 0.06 mm polyimide film offers high insulation, chemical resistance and tensile strength over 115 N/25mm.

Suitable for

• Sublimation transfer alignment
• Heat press masking
• 3D printer bed protection
• PCB soldering and wave soldering
• Electrical insulation

Key specifications

• Tape width: 20 mm
• Tape length: 33 m
• Colour: Blue
• Maximum heat resistance: 260 °C (500 °F)
• Operating temperature range: -73 °C to 260 °C
• Adhesive type: Silicone
• Dielectric strength: >5 kV
• Tensile strength: >115 N/25mm
• Elongation at break: >50%
• Chemical resistance: Acid and alkali resistant

Recommendations

Store in a cool, dry place away from direct sunlight. Apply to clean, dry surfaces for best adhesion.