LC-Power LC-TG-4G teplovodivá pasta - sivá, 4 g, 4 W/mK

The LC-Power LC-TG-4G stands out as a silicone-based thermal compound with a solid 4 W/mK conductivity, packaged in a convenient 4-gram syringe for precise application. Unlike many pastes that cure or harden over time, this non-curing formula remains stable and easy to work with, ensuring long-term reliability for CPU, GPU, and chipset cooling.

Highlights

• Thermal conductivity: 4 W/mK
• Net content: 4 g
• Colour: grey
• Non-curing, non-corrosive, and non-toxic
• Operating temperature range: -30 °C to 280 °C

In daily use

The syringe applicator allows controlled dispensing, minimizing waste and mess during installation. The paste's silicone base provides good adhesion and gap-filling properties on uneven surfaces, while its electrical non-conductivity prevents short circuits if accidentally spread beyond the die.

Full specifications

• Product type: Thermal paste
• Thermal conductivity: 4 W/mK
• Density: 2.5 g/cm³
• Operating temperature range: -30 °C to 280 °C
• Electrical conductivity: No
• Non-corrosive: Yes
• Non-curing: Yes
• Non-toxic: Yes
• Base material: Silicone-based compound

Final note

LC-Power's LC-TG-4G provides a dependable thermal interface for enthusiasts and system builders who need consistent performance without the hassle of curing or electrical risks.