Savio TG-02 teplovodivá pasta 8.5 W/m·K 4 g

The Savio TG-02 thermal paste is a high-performance heat sink compound designed to efficiently transfer heat between a processor and its cooler. With a thermal conductivity of 8.5 W/m·K, this 4-gram paste ensures optimal heat dissipation for reliable system cooling.

Key features

• Thermal conductivity of 8.5 W/m·K for efficient heat transfer
• Carbon microparticles fill microscopic surface cavities for improved contact
• Non-electrically conductive formula, free of metal oxides, eliminating short-circuit risk
• Easy-to-apply consistency suitable for beginners
• Practical syringe container allows precise application and multiple uses
• Includes a spatula for convenient and even distribution
• 4-gram capacity sufficient for several applications