Tepelná pasta PROLIMATECH PK-1 nano-hliníková pasta 1,5 g

PROLIMATECH PK-1 Nano Aluminium paste 1.5 g is a precision thermal compound formulated to improve heat transfer between electronic components and heatsinks. Supplied in a compact 1.5 g tube, this thermal grease is based on nano-sized aluminium particles suspended in a thermally conductive carrier, intended to fill microscopic surface imperfections and reduce thermal resistance. The product is suitable for desktop processors, graphics cards and small electronics where a small quantity and accurate application are required.

Advantages

The PK-1 nano aluminium formulation provides consistent thermal conductivity and stable performance over time without requiring large amounts of paste. Its small tube format enables controlled, precise application and reduces waste for single-component re-topping or one-time installations. The compound is electrically non-conductive and compatible with common heatsink materials, allowing safe use in typical PC and small-electronics assemblies.

Suitable for

• Desktop CPUs and aftermarket coolers
• Graphics card GPU contact surfaces
• Small form-factor electronics and single-board computers
• Replacements or touch-ups where minimal paste quantity is needed

Key specifications

• Composition: nano aluminium particles in a thermally conductive carrier
• Package size: 1.5 g tube for precise application
• Phase: paste/grease suitable for gap filling between component and heatsink
• Electrical behavior: formulated to be non-conductive in normal use
• Compatibility: suitable for metal heatsinks and common electronic substrates

How to use

Before applying, clean both the component and heatsink surfaces with isopropyl alcohol to remove old thermal compound, dust and oils. Apply a small, pea-sized amount of PK-1 to the center of the chip or use a thin line for elongated surfaces, then mount the heatsink and secure it according to the manufacturer’s instructions to spread the paste evenly. For graphics cards or irregular surfaces, use a thin, even layer to ensure full contact and avoid excess that can squeeze out to surrounding areas. Allow the assembly to settle and re-check mounting after initial thermal cycles.

Recommendations

Use the 1.5 g tube for single or occasional applications; store the tube capped and in a cool, dry place to maintain paste consistency. Reapply when replacing cooling hardware or if thermal performance degrades noticeably. Follow standard ESD precautions when handling components and avoid contaminating the paste with dust or moisture.