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Teplovodivá pasta ek water blocks EK-Loop NGP 5 g — teplovodivá pasta pre CPU a GPU

Teplovodivá pasta ek water blocks EK-Loop NGP 5 g — teplovodivá pasta pre CPU a GPU
Teplovodivá pasta ek water blocks EK-Loop NGP 5 g — teplovodivá pasta pre CPU a GPU
Teplovodivá pasta ek water blocks EK-Loop NGP 5 g — teplovodivá pasta pre CPU a GPU
Teplovodivá pasta ek water blocks EK-Loop NGP 5 g — teplovodivá pasta pre CPU a GPU
Teplovodivá pasta ek water blocks EK-Loop NGP 5 g — teplovodivá pasta pre CPU a GPU
Teplovodivá pasta ek water blocks EK-Loop NGP 5 g — teplovodivá pasta pre CPU a GPU
Teplovodivá pasta ek water blocks EK-Loop NGP 5 g — teplovodivá pasta pre CPU a GPU
Teplovodivá pasta ek water blocks EK-Loop NGP 5 g — teplovodivá pasta pre CPU a GPU
14,38 €
EK Water Blocks EK-Loop NGP thermal paste in a 5 g syringe is a thermally conductive compound formulated to improve heat transfer between processors and cooling solutions. The paste fills microscopic imperfections on CPU and GPU heat spreaders and cooler contact surfaces, reducing thermal resistance... Čítať viac
Sklad 2 Kód 312379 Značka EK Water Blocks Model 3831109910214 Záruka 2 roky

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EK Water Blocks EK-Loop NGP thermal paste in a 5 g syringe is a thermally conductive compound formulated to improve heat transfer between processors and cooling solutions. The paste fills microscopic imperfections on CPU and GPU heat spreaders and cooler contact surfaces, reducing thermal resistance and helping maintain lower operating temperatures under load. Supplied in a compact syringe, the product is suitable for initial builds, periodic maintenance and aftermarket cooling upgrades.

Advantages

EK-Loop NGP thermal compound offers low thermal resistance and consistent consistency for reliable application. The syringe format allows precise dispensing and controlled coverage with minimal waste. Its formulation is non-curing, which means it remains pliable over time and does not harden, supporting rework and component replacement without residue removal complications.

Suitable for

  • Applying between CPUs and air or liquid coolers
  • Thermal interface on GPU coolers and aftermarket GPU blocks
  • Small heatsinks and other electronic components requiring improved thermal contact

Key specifications

  • Net weight: 5 g
  • Packaging: syringe for controlled dispensing
  • Intended use: CPU and GPU thermal interface
  • Thermal paste type: non-curing, reworkable compound

How to use

Clean both mating surfaces (CPU/GPU heat spreader and cooler base) with isopropyl alcohol or a manufacturer-recommended cleaner and allow them to dry. Apply a small, pea-sized amount of the thermal paste to the center of the processor heat spreader. Mount the cooler according to its instructions and secure it to spread the compound evenly. If disassembling later, remove old compound with a lint-free cloth and alcohol before reapplying fresh paste.

Recommendations

Use a minimal amount sufficient to achieve an even, thin layer after mounting; excessive paste can reduce thermal performance. Store the syringe in a cool, dry place away from direct sunlight and keep caps/seals intact to prevent drying out.

Hlavné vlastnosti
  • Applying between CPUs and air or liquid coolers
  • Thermal interface on GPU coolers and aftermarket GPU blocks
  • Small heatsinks and other electronic components requiring improved thermal contact
  • Net weight: 5 g
  • Packaging: syringe for controlled dispensing
  • Intended use: CPU and GPU thermal interface
  • Thermal paste type: non-curing, reworkable compound
Vývoj ceny za posledných 6 mesiacov
Teplovodivá pasta ek water blocks EK-Loop NGP 5 g — teplovodivá pasta pre CPU a GPU
Aktuálna
14,38 €
Najnižšia
13,67 €
Najvyššia
14,38 €
Zmena za 24 h
+0,55 €   +4%
Týždeň
+0,36 €   +3%
Mesiac
+0,38 €   +3%

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