Tepelná podložka DeLOCK 18468 3,2 W/m·K sivá 20x120x0,5 mm

The DeLOCK 18468 thermal pad is a grey, flexible heat-conductive pad measuring 20 x 120 x 0.5 mm with a thermal conductivity of 3.2 W/m·K. It is designed to improve heat dissipation from electronic components such as M.2 modules, helping to stabilise operating temperatures and support longer component life. The pad is supplied in a polybag and fits applications where a thin, conformable thermal interface is required.

Advantages

The thermal pad provides effective thermal transfer with a rated conductivity of 3.2 W/m·K while remaining thin at 0.5 mm to suit compact assemblies. It features low oil bleeding, which reduces contamination of electronic contacts and helps retain the pad's thermal and mechanical properties over time, ensuring consistent heat dissipation.

Suitable for

• Heat dissipation for M.2 modules and SSDs
• Thermal interface between chips and heatsinks in compact devices
• Filling small gaps in laptop or desktop electronics

Key specifications

• Brand: DELOCK
• Model / MPN: 18468
• EAN: 4043619184682
• Thermal conductivity: 3.2 W/m·K
• Dimensions: 20 x 120 x 0.5 mm
• Colour: Grey
• Packaging: Polybag

How to use

Clean the component surfaces to remove dust, oils or residues before applying the pad. Cut the pad to the required shape and size if necessary, peel off any protective liners, and place it between the heat source (e.g. an M.2 module) and the heatsink or chassis contact. Ensure even contact without wrinkles or trapped air and reassemble the device according to the manufacturer’s instructions.

Recommendations

For best results, use the pad in environments within the device’s specified operating temperature range and avoid excessive compression beyond the pad’s intended thickness. If a different thickness or higher thermal conductivity is needed, select a product matching those specific requirements.