Teplovodivá pasta Corsair TM30

CORSAIR TM30 thermal paste is a low-viscosity zinc oxide compound designed for enthusiast CPU and GPU cooling. It provides improved heat transfer between processors and coolers by filling microscopic surface imperfections, helping to reduce operating temperatures without frequent reapplication.

Advantages

The formula offers ultra-low thermal impedance for better CPU cooling compared with common thermal pastes. Its low viscosity enables thorough contact by filling tiny gaps between the heatspreader and cooler contact plate. The compound is stable over time, resisting drying, cracking or consistency changes, and is non-conductive and non-toxic with no volatile compounds.

Key specifications

• Composition: zinc oxide based thermal compound
• Viscosity: low-viscosity formula for gap filling
• Electrical properties: non-conductive
• Toxicity: non-toxic
• Volatile compounds: contains zero volatile compounds
• Durability: high stability, resists drying and cracking
• Intended use: CPU and GPU thermal interface

How to use

Clean both the processor heatspreader and cooler contact surface with isopropyl alcohol and a lint-free cloth. Apply a small, pea-sized amount of TM30 to the center of the CPU or follow the cooler manufacturer's recommended application pattern. Mount the cooler evenly to spread the compound, then secure according to the cooler instructions. No frequent reapplication is required thanks to the compound's long-term stability.

Recommendations

Use in well-ventilated workspace and avoid contact with clothing or skin. Although non-conductive and non-toxic, keep the compound away from children and pets and store it capped in a cool, dry place.