Účet Kontakt
Váš košík
Doručenie cez DPD a FedEx
Pomoc? Opýtajte sa AI

Teplovodivá pasta Kolink Core TX-6 1,5 g - teplovodivé médium pre CPU/GPU

Teplovodivá pasta Kolink Core TX-6 1,5 g - teplovodivé médium pre CPU/GPU
Teplovodivá pasta Kolink Core TX-6 1,5 g - teplovodivé médium pre CPU/GPU
Teplovodivá pasta Kolink Core TX-6 1,5 g - teplovodivé médium pre CPU/GPU
Teplovodivá pasta Kolink Core TX-6 1,5 g - teplovodivé médium pre CPU/GPU
Teplovodivá pasta Kolink Core TX-6 1,5 g - teplovodivé médium pre CPU/GPU
Teplovodivá pasta Kolink Core TX-6 1,5 g - teplovodivé médium pre CPU/GPU
5,03 €
Kolink Core TX-6 1.5 g is a thermal compound formulated to improve heat transfer between processor heat spreaders and cooling interfaces. Supplied in a small syringe for precise dispensing, this thermal paste is intended for use on CPUs and GPUs where small, controlled amounts are required. The past... Čítať viac
Sklad 50 Kód 312839 Značka KOLINK Model KL-TX6-1 Záruka 2 roky

Doprava a vrátenie tovaru

Predpokladané doručenie piatok, októbra 16
O stave zásielky Vás budeme priebežne informovať prostredníctvom nášho podrobného systému sledovania zásielok
Možnosti platby
Platobná kartaVisaMastercardPayPalApple PayGoogle PayBankový prevod

Kolink Core TX-6 1.5 g is a thermal compound formulated to improve heat transfer between processor heat spreaders and cooling interfaces. Supplied in a small syringe for precise dispensing, this thermal paste is intended for use on CPUs and GPUs where small, controlled amounts are required. The paste’s consistency enables filling microscopic gaps between components and heatsinks to enhance thermal contact and reduce operating temperatures during normal and heavy workloads.

Advantages

The thermal compound offers good thermal conductivity for a small-volume application, allowing targeted treatment of single sockets or GPU cores without excess waste. The syringe format and compact quantity support accurate placement and controlled dispensing, making it convenient for maintenance, upgrades, and iterative testing. Its neutral electrical properties reduce the risk of short circuits when applied within recommended areas.

Suitable for

  • Desktop CPU and GPU contact surface filling
  • System maintenance and thermal paste replacement
  • Small-scale cooling upgrades and repairs
  • Bench testing and iterative tuning where minimal paste is needed

Key specifications

  • Net content: 1.5 g syringe suitable for limited or single-component applications
  • Form: viscous paste supplied in a precision syringe applicator
  • Intended use: thermal interface material for CPU and GPU heat transfer
  • Packaging: compact syringe for controlled dispensing and storage

How to use

Before application, power off the system and discharge any static by grounding yourself. Clean the processor heat spreader and heatsink contact surface thoroughly with isopropyl alcohol and a lint-free cloth until all old compound and contaminants are removed. Apply a small, pea-sized amount of the paste to the center of the chip, then mount the cooler evenly and secure according to the cooler manufacturer’s instructions to spread the compound into a thin, even layer. For GPUs or multiple contact points, apply single small dots or thin lines as appropriate for the contact area. Avoid over-application; excess compound can squeeze out and complicate future cleaning.

Recommendations

Use the syringe’s precision tip for controlled dispensing and store the cap tightly after use to prevent drying. Replace the thermal paste during major maintenance or when temperatures increase noticeably compared to baseline measurements. When reapplying, remove old paste completely and follow the same cleaning and application steps to ensure consistent thermal performance.
Hlavné vlastnosti
  • Desktop CPU and GPU contact surface filling
  • System maintenance and thermal paste replacement
  • Small-scale cooling upgrades and repairs
  • Bench testing and iterative tuning where minimal paste is needed
  • Net content: 1.5 g syringe suitable for limited or single-component applications
  • Form: viscous paste supplied in a precision syringe applicator
  • Intended use: thermal interface material for CPU and GPU heat transfer
  • Packaging: compact syringe for controlled dispensing and storage
Vývoj ceny za posledných 6 mesiacov
Teplovodivá pasta Kolink Core TX-6 1,5 g - teplovodivé médium pre CPU/GPU
Aktuálna
5,03 €
Najnižšia
2,46 €
Najvyššia
5,03 €
Zmena za 24 h
+0,54 €   +12%
Týždeň
+0,55 €   +12%
Mesiac
+0,56 €   +13%

Populárne produkty v tejto kategórii

Dobrý deň, som AI asistent DistriNode. Pomôžem Vám nájsť produkty, porovnať možnosti, vytvoriť cenovú ponuku v PDF alebo otvoriť požiadavku na podporu.