Teplovodivá pasta SAVIO TG-03 13,5 W/m·K, 2 g — teplovodivá pasta

SAVIO TG-03 is a thermal grease formulated to fill microscopic gaps between a processor and a heatsink, ensuring efficient heat transfer. The compound contains carbon microparticles that improve contact with surfaces and provide high thermal conductivity, making it suitable for standard cooling systems and overclocking scenarios.

Advantages

SAVIO TG-03 is non-electrically conductive because it does not contain metal oxides, which reduces the risk of short circuits and corrosion. Its syringe-style container and included spatula allow precise application and multiple uses, while a consistency designed for easy spreading helps achieve an even layer on the CPU surface.

Key specifications

• Thermal conductivity: 13.5 W/mK
• Filler: carbon microparticles
• Electrical conductivity: non-conductive (no metal oxides)
• Available sizes: 2 g and 10 g
• Packaging: syringe with spatula included, designed to prevent drying

How to use

Clean both the processor heat spreader and the heatsink base from old thermal compound and debris. Apply a small amount of SAVIO TG-03 in the center of the CPU or spread a thin, even layer using the supplied spatula. Mount the heatsink according to the manufacturer instructions to achieve good contact and even pressure. Reuse the product by resealing the syringe after each use and store in a cool, dry place.

Recommendations

For best results, use SAVIO TG-03 when installing or re-seating a cooler and check mounting pressure and contact surface to avoid air gaps; select the appropriate tube size (2 g for single use, 10 g for multiple applications).