Teplovodivá pasta SAVIO TG-05 4g — tepelná vodivosť 18 W/m·K, viskozita 2,6 g/ml

SAVIO TG-05 4g is a thermal paste formulated to improve heat transfer between processors and heatsinks in PCs, laptops and small electronics. The compound provides a thermal conductivity of 18 W/m·K and a viscosity around 2.6 ± 0.1 g/ml, and is supplied in a 4 g syringe. It is designed to operate across a wide temperature range from -40 °C to 230 °C, making it suitable for typical and demanding thermal interface applications.

Advantages

The paste’s high thermal conductivity helps accelerate heat flow from CPU or GPU surfaces to cooling solutions. Its reported viscosity ensures a stable, non-runny consistency that spreads to fill microscopic surface irregularities. The operating temperature range supports use in both low-temperature and high-load scenarios. Supplied in a compact syringe, the material is convenient for controlled application during assembly or maintenance.

Suitable for

Key specifications

How to use

Clean mating surfaces (processor heat spreader and heatsink base) from old thermal compound, dust and debris using a suitable solvent and lint-free cloth. Apply a small, even amount of SAVIO TG-05 to the center of the processor surface and mount the heatsink according to the manufacturer’s instructions so the paste spreads into a thin, continuous layer. Reassemble the cooling assembly and verify mounting torque and contact according to the heatsink or system manual.

Recommendations

Use minimal necessary quantity to achieve a thin, continuous interface layer; avoid excessive amounts that can increase thermal resistance or interfere with mounting. Store the syringe in a cool, dry place and follow equipment manufacturer guidelines for reapplication intervals when servicing cooling systems.