THERMALTAKE teplovodivá pasta - TG-60

TG-60 Liquid Metal Compound is Thermaltake’s first liquid metal compound with high thermal conductivity of
52 W/m-k, and can be applied on copper or nickel-plated materials with excellent cooling performance.

High Thermal Conductivity
With a thermal conductivity of 52 W/m-k, the TG-60 liquid metal compound shows a high heat transfer rate better than other thermal compounds, ensuring the best cooling performance.

Even Better Cooling Performance
We’ve also tested TG-60 within our Thermal Chamber running Full Load for 30 minutes on each model under 25。 C ambient temperature and 50% humidity. Overclocking 4.8 GHz, we can see that compared to regular thermal compounds, TG-60 shows outstanding cooling performance and can perform even better than liquid metals from other brands.

All-In-One Application Kit
TG-60 Liquid Metal Compound has an application kit, which includes a set of tools for immediate use.