Základná doska ASRock B850M Steel Legend WiFi — AMD B850, socket AM5, microATX, DDR5, 4 DIMM, Wi-Fi 7, 2.5Gb LAN

This motherboard features an optimized VRM with a 12+2+1 power phase design, upgraded 20K Black capacitor with 1000uF capacitance, Dr. MOS integrated power stages, and Hi-Density CPU power connectors. It includes 2oz copper PCB layers for improved thermal and power delivery, support for DDR5 XMP and AMD EXPO profiles, PCIe Gen5 M.2 for next‑generation SSDs and PCIe Gen4 M.2 slots, M.2 bottom heatsink, enlarged graphics card release latch, and onboard Wi‑Fi 7 plus 2.5 Gb/s LAN. Audio is handled by Nahimic with multiple noise‑reduction features, and the board offers extensive cooling controls, Polychrome RGB and SignalRGB support, BIOS Flashback, EZ auto driver installer and a flexible integrated I/O shield.

Advantages

The upgraded 20K capacitor increases capacitance to 1000uF and extends lifespan, resulting in higher charge storage, lower ripple and more stable output current for improved system stability. The 12+2+1 VRM layout with Dr. MOS delivers efficient, high current per phase for better thermal performance and overclocking headroom. Hi‑Density power connectors and 2oz copper PCB provide reliable power delivery under heavy loads. PCIe Gen5 M.2 and Gen4 M.2 support enable faster storage options, while Wi‑Fi 7 and 2.5 Gb/s LAN improve network throughput and lower latency. Integrated cooling features, PWM/DC fan detection, thermistor header and Fan‑Tastic Tuning enable precise thermal management. Nahimic audio enhances communication quality and surround sound on a variety of devices. Polychrome RGB and SignalRGB support provide flexible lighting customization.

Key specifications

• VRM: 12+2+1 power phase design with Dr. MOS
• Capacitor: 20K Black capacitor, 1000uF capacitance
• Power connectors: Hi‑Density CPU and ATX power connectors
• PCB: 2oz copper inner layers
• Memory: DDR5 with Intel XMP / AMD EXPO profile support
• M.2: PCIe Gen5 Blazing M.2 and Hyper M.2 Gen4 x4 support; M.2 bottom heatsink
• Expansion ease: Graphics Card Lite Release latch
• Cooling: Aluminum heatsinks, PWM/DC fan support, thermistor header, Fan‑Tastic Tuning
• Wireless: Wi‑Fi 7 (802.11be) with Multi‑link Operation
• LAN: Dragon 2.5 Gb/s Ethernet
• USB/Peripherals: Lightning Gaming Ports for low jitter peripheral connections
• Audio: Nahimic audio with static noise suppression, echo cancellation, lateral sound cancellation, voice stabilizer, Sound Tracker
• Lighting: Onboard RGB and addressable RGB headers, Polychrome RGB, SignalRGB support
• BIOS/Tools: BIOS Flashback, EZ auto driver installer
• I/O: Flexible integrated I/O shield

How to use

Install the motherboard into a compatible ATX chassis, connect the Hi‑Density CPU and ATX power connectors, and install DDR5 memory modules that support Intel XMP or AMD EXPO if you plan to enable pre‑tested overclocking profiles. Mount M.2 SSDs into the Gen5 or Gen4 slots and secure them with the M.2 heatsink to improve thermal performance. Attach system fans to headers supporting PWM or DC mode and, if needed, connect an external thermistor to the thermistor header for additional temperature monitoring. Use Fan‑Tastic Tuning in the UEFI or A‑Tuning software to configure fan curves. For networking, set up Wi‑Fi 7 or connect via the Dragon 2.5 Gb/s LAN. Use BIOS Flashback with a USB drive and power supply to update firmware without CPU or RAM present. Install drivers using the preinstalled LAN driver or the EZ auto driver installer tool.

Recommendations

For stable operation and best results, use high‑quality DDR5 memory modules certified for XMP or EXPO, ensure proper case airflow to take advantage of the aluminum heatsinks and 2oz copper layers, and secure high‑speed M.2 SSDs with the provided heatsink. When overclocking, verify adequate CPU power delivery via the Hi‑Density connectors and monitor temperatures with the thermistor and fan controls.