DIMM 32 GB DDR5-5600 (1x 32 GB), operačná pamäť čierna, AX5U5600C4632G-SLABBK, XPG Lancer Blade, INTEL XMP, AMD EXPO

The XPG LANCER BLADE DDR5 32 GB (2 x 16 GB) memory kit provides high-speed DDR5 performance at 5600 MT/s with on-die ECC and a low-profile heatsink designed for compact PC builds. It includes Power Management IC (PMIC) support for improved power stability and multiple voltage profiles for compatibility and power efficiency. The module supports Intel XMP 3.0 and AMD EXPO for simplified overclocking and platform compatibility.

Advantages

The low-profile heatsink fits in smaller cases and avoids interference with large CPU tower coolers while adding a clean, geometric aesthetic. Integrated PMIC and lower DDR5 operating voltages improve power delivery and efficiency compared with DDR4. On-die ECC provides real-time error correction for increased stability and reliability. Built with quality ICs and PCBs, the module is suitable for reliable everyday use and overclocking when required.

Suitable for

• Compact and small-form-factor PC builds
• Gaming systems requiring high-speed memory
• Professional workstations handling demanding applications
• Systems where stability and error correction are important

Key specifications

• Capacity: 32 GB (2 x 16 GB)
• Type: DDR5
• Speed: 5600 MT/s
• CAS latency: 46
• Supported voltages: 1.1 V, 1.3 V, 1.35 V, 1.4 V
• On-die ECC (error correcting code)
• Supports Intel XMP 3.0 and AMD EXPO

How to use

Install the modules into compatible DDR5 DIMM slots on a motherboard that supports DDR5 memory. Ensure the system is powered off and grounded before installation. After physical installation, enable Intel XMP 3.0 or AMD EXPO in the BIOS/UEFI if you want to apply predefined overclocking profiles; otherwise the modules will run at standard JEDEC speeds. Follow your motherboard manual for slot population recommendations and BIOS settings.

Recommendations

If overclocking, verify motherboard compatibility and use incremental voltage and frequency adjustments while monitoring system stability and temperatures. For compact cases, confirm clearance with installed CPU coolers before assembly.