CPU chladič Dynatron Z60 pre LGA1851 LGA1700, hliníkové puzdro, 80-mm ventilátor

Dynatron Z60 is a compact CPU cooler designed for systems using LGA1851 and LGA1700 sockets. The cooler has an aluminium body and an integrated 80 mm fan, offering a small footprint suitable for compact desktops, mini‑PCs and HTPCs. It targets mainstream processors where case clearance is limited and aims to provide consistent thermal performance in tight spaces.

Advantages

The aluminium heatsink provides effective heat dissipation while keeping weight and height low. The 80 mm fan balances airflow and acoustic performance to reduce noise in small‑form‑factor builds. The low‑profile design allows installation in cases with restricted CPU cooler clearance, and compatibility with current LGA1700 family sockets ensures straightforward mounting on supported motherboards.

Suitable for

• Compact desktops and mini‑ITX systems with limited CPU cooler clearance
• Home theater PCs (HTPCs) where low noise and small size are important
• Office and productivity PCs using mainstream CPUs
• System builds that require a low‑profile cooler for tight cases

Key specifications

• Socket compatibility: LGA1851 and LGA1700
• Heatsink material: aluminium
• Cooling fan size: 80 mm
• Form factor: low‑profile / compact design
• Use case: designed for mainstream CPU cooling in limited‑clearance systems

How to use

Prepare the motherboard and CPU according to the motherboard manufacturer’s installation instructions. Apply an appropriate amount of thermal compound to the CPU heat spreader. Position the Dynatron Z60 on the CPU socket aligned with mounting points for LGA1851 or LGA1700 and secure the cooler using the provided mounting hardware. Connect the 3‑ or 4‑pin fan cable to the CPU fan header on the motherboard and verify fan rotation and BIOS fan settings after the first boot. Ensure that case airflow is not obstructed and that the cooler has sufficient clearance from memory modules and other components.

Recommendations

Use the Dynatron Z60 with mainstream CPUs rather than high‑TDP processors; in systems with higher heat output, consider more robust cooling solutions. Regularly clean the fan and heatsink fins to maintain airflow and cooling efficiency, and verify that the fan header provides appropriate voltage or PWM control for quieter operation.