InLine teplovodivá pasta 0,5 g s aplikátorovou špachtľou — teplovodivá pasta pre CPU a GPU

InLine Thermal Compound paste 0.5 g with applicator scoop is a heat-conductive interface material intended for use between processors, graphics chips and their cooling solutions. Supplied in a small tube with a scoop applicator, this thermal grease fills microscopic gaps between the heat-generating component and the heatsink to improve thermal transfer and reduce operating temperatures. The compact tube size is suitable for single or occasional applications during cooler installation, component replacement or routine maintenance.

Advantages

The paste provides reliable contact between mating surfaces, with a consistency that allows controlled application using the included scoop. Its small quantity makes it economical for one-time use while keeping storage and handling simple. The product is neutral in appearance and is formulated to remain stable after application, helping to maintain consistent thermal performance under normal operating conditions.

Suitable for

Key specifications

How to use

Ensure both the component surface and the heatsink are clean and free of old thermal material, dust and grease. Apply a small, pea-sized amount of paste to the centre of the processor or chip. Use the supplied scoop to spread a thin, even layer over the contact surface or allow the heatsink pressure to spread the paste when installing the cooler. Reassemble the cooler according to manufacturer instructions and verify secure mounting to ensure proper thermal contact.

Recommendations

Use the supplied applicator to avoid contamination and apply only a minimal amount necessary to achieve a thin, continuous thermal layer. For repeated maintenance on the same device, clean off the old compound completely before reapplying. Store the tube in a cool, dry place away from direct sunlight and out of reach of children.