Tepelná pasta Iceberg Thermal FUZEIce

FUZEIce™ thermal paste offers low operating temperatures combined with high thermal conductivity of 11.25 W/mK, providing efficient heat transfer between CPU/GPU and cooler to help maintain stable performance and support higher clock speeds.

Advantages

The compound spreads evenly in thin layers to maximize contact and heat flow. It is formulated to withstand temperatures up to 200°C and retain stability for years. The package includes a precision applicator and an angled spreader to simplify application and reduce mess.

Key specifications

• Thermal conductivity: 11.25 W/mK
• Maximum operational temperature: up to 200°C
• Application tools: precision applicator and angled spreader included
• Designed for CPU and GPU heat transfer

How to use

Clean the surfaces of the processor and cooler with isopropyl alcohol and a lint-free cloth. Apply a small, pea-sized amount of FUZEIce™ thermal paste to the center of the chip or use the precision applicator for an even line. Mount the cooler and allow pressure to spread the paste into a thin layer, or use the included angled spreader to distribute the compound manually for uniform coverage. Reassemble the cooler and test system temperatures under load.

Recommendations

Use FUZEIce™ on CPUs and GPUs with compatible coolers. Replace thermal paste every few years or if temperatures rise noticeably. Store the product in a cool, dry place and keep the applicator tips clean to ensure consistent application.