Tepelná pasta Iceberg Thermal FUZEIce Plus

Iceberg Thermal FUZEIce Plus is a high-performance thermal paste with a thermal conductivity of 13 W/m·K and a density of 2.6 g/cm³ in a 3.5 g package. This thermal compound provides efficient heat transfer between CPUs, GPUs and other electronic components to support stable operation and improved cooling performance. The compound is rated for an operating temperature range from -50 °C to 200 °C and is green in colour.

Advantages

FUZEIce Plus combines high thermal conductivity with a low operational temperature to enable effective heat dissipation and support higher clock speeds. The package includes a precision applicator and an angled spreader for controlled, low-mess application. The paste is formulated to remain functional up to 200 °C and is designed to provide long-lasting thermal performance.

Suitable for

• CPU heat sinks and integrated heat spreaders
• GPU cooling and graphics card maintenance
• Cooling of other electronic components and power modules

Key specifications

• Thermal conductivity: 13 W/m·K
• Net weight: 3.5 g (0.0035 kg)
• Density: 2.6 g/cm³
• Operating temperature: -50 °C to 200 °C
• Colour: Green
• Brand: Iceberg Thermal, MPN: BLACKICEP4G-00A, EAN: 1230000071710

How to use

Clean contact surfaces thoroughly to remove old thermal material, dust and oils before application. Apply a small amount of FUZEIce Plus to the centre of the processor or component, then use the supplied angled spreader to create a thin, even layer for optimal contact with the heat sink. Reassemble the cooler and ensure even mounting pressure to avoid air gaps.

Recommendations

Use sparingly: a thin, even layer provides the best thermal transfer. Avoid contaminating the compound with dirt or moisture. Replace the thermal paste when removing or reseating the cooler, or if thermal performance degrades over time.