Tepelná podložka DeLOCK 18470 3.2 W/m·K sivá 20x120x2 mm

The DeLOCK 18470 thermal pad is a grey heat-conductive pad with a thermal conductivity of 3.2 W/m·K and dimensions of 20 x 120 x 2 mm. It is intended to improve heat dissipation from electronic components such as M.2 modules, helping to stabilise performance and extend component life. The pad is supplied in a polybag and designed for use in computer and electronic applications where controlled thermal transfer is required.

Advantages

This thermal pad offers a balanced thermal conductivity of 3.2 W/m·K for effective heat transfer while remaining flexible for easy placement. It features low oil bleeding, which minimises contamination of contacts and sensitive electronics and helps the pad retain its thermal and mechanical properties over time for stable heat dissipation.

Suitable for

• Heat dissipation on M.2 modules and SSDs
• Thermal interface between chips, heatsinks and enclosures
• General thermal management in desktop and small-form-factor systems

Key specifications

• Brand: DELOCK
• Model / MPN: 18470
• EAN: 4043619184705
• Thermal conductivity: 3.2 W/m·K
• Colour: Grey
• Dimensions: 20 x 120 x 2 mm
• Packaging: Polybag
• Category: Computer components accessories

How to use

Clean the contact surfaces and remove any dust or residues before application. Cut the pad to the required size if necessary, then place it between the heat source (for example an M.2 module) and the heatsink or enclosure so that it makes even contact. Apply gentle, even pressure to ensure full surface contact without excessive compression. Reassemble the device following the manufacturer’s instructions.

Recommendations

For optimal results, avoid stretching the pad during installation and keep it away from sharp edges. Inspect the pad periodically for any signs of wear or deformation and replace it if thermal performance degrades.