Tepelná podložka DeLOCK 18473 3 W/m·K sivá 20x70x0,75 mm

The DeLOCK 18473 thermal pad is a grey, flexible heat-conductive interface with a thermal conductivity of 3 W/m·K and dimensions of 20 x 70 x 0.75 mm. It is designed to provide improved heat dissipation for electronic components such as M.2 modules, helping to stabilise operating temperatures and support reliable performance over time.

Advantages

The pad offers a balance of thermal conductivity and conformability to fill gaps between components and heatsinks, providing consistent thermal transfer while remaining easy to cut to size. Its thin 0.75 mm profile makes it suitable for compact installations where space is limited.

Suitable for

• Thermal management of M.2 SSD modules
• Filling gaps between small PCBs and heatsinks
• Use in laptops, desktops and compact electronic assemblies

Key specifications

• Brand: DELOCK
• Model / MPN: 18473
• EAN: 4043619184736
• Thermal conductivity: 3 W/m·K
• Colour: Grey
• Dimensions: 20 x 70 x 0.75 mm

How to use

Measure and cut the thermal pad to the required shape and size to match the component and heatsink surfaces. Clean both contact surfaces to remove dust, oils or residues, then place the pad between the component (for example an M.2 module) and the heatsink, ensuring even contact across the surfaces. Reassemble the device and apply appropriate fastening to maintain compression and contact.

Recommendations

For optimal results, ensure surfaces are clean and flat; avoid overstretching the pad when cutting. Use the 0.75 mm thickness in applications with limited clearance and consider thicker pads only if additional gap filling is required. Store the pad in a dry environment away from direct sunlight.