Tepelná podložka DeLOCK 18474 3 W/m·K sivá 20x70x1,75 mm

The DeLOCK 18474 thermal pad is designed to improve heat dissipation in electronic components such as M.2 modules. With a thermal conductivity of 3 W/m·K and dimensions of 20 x 70 x 1.75 mm, the grey pad provides a reliable interface for transferring heat away from chips and modules to heatsinks or metal housings, helping to stabilise performance and potentially extend component lifespan.

Advantages

The thermal pad offers a balance of thermal conductivity and conformability to fill gaps between components and heatsinks. Its 3 W/m·K rating ensures effective heat transfer for many small electronic assemblies. Supplied in a polybag, the pad is a compact and easy-to-handle solution for targeted thermal management tasks.

Suitable for

• Thermal coupling of M.2 SSD modules
• Heat transfer between ICs and heatsinks in compact devices
• Gap filling in laptop or mini-PC thermal solutions

Key specifications

• Brand: DELOCK
• Model / MPN: 18474
• Thermal conductivity: 3 W/m·K
• Colour: Grey
• Dimensions (W x D x H): 20 x 70 x 1.75 mm
• Packaging: Polybag
• EAN: 4043619184743
• Manufactured in: China or Taiwan

How to use

Clean the contact surfaces thoroughly to remove dust, grease or old thermal interface material. Cut the pad to the required size if necessary and place it so that it covers the heat-generating component and makes firm contact with the heatsink or metal surface. Ensure even pressure and correct alignment when reassembling the device to maintain good thermal contact. Avoid stretching or folding the pad during installation.

Recommendations

Use the pad for targeted thermal management in small electronic assemblies where a gap-filling, non-liquid thermal interface is needed. Replace the pad if it becomes compressed, damaged or contaminated; verify compatibility with device tolerances and clearances before installation.