Teplovodivá pasta SAVIO TG-05 2g — tepelná vodivosť 18 W/m·K, 2 ml

SAVIO TG-05 2g is a thermal paste formulated to improve heat transfer between electronic chips and their coolers. Supplied as 2 ml (2 g) of paste with a viscosity around 2.6 g/ml, the compound offers thermal conductivity of 18 W/m·K and is rated for operation in the temperature range from -40 °C to 230 °C. The paste is intended for desktop and embedded systems to enhance thermal contact at CPU, GPU and other component heatsink interfaces.

Advantages

The high thermal conductivity of 18 W/m·K supports faster heat dissipation from processors and other hot components to connected heatsinks. Its specified operating temperature range ensures stable performance across typical and extreme operating conditions. With a paste density near 2.6 g/ml the product spreads evenly to fill microscopic surface irregularities without excessive flow. The formulation is electrically non-conductive, providing a lower risk of short circuits if small amounts are applied beyond chip surfaces.

Suitable for

Key specifications

How to use

Clean both the processor/chip surface and the heatsink contact area with isopropyl alcohol and a lint-free cloth to remove old paste and contaminants. Apply a small, pea-sized amount of the SAVIO TG-05 paste to the center of the chip surface, then mount the cooler evenly following the cooler manufacturer's instructions; the pressure will spread the paste into a thin thermal interface layer. Avoid applying excessive amounts—use just enough to fill surface imperfections for an even contact. If reapplying, remove the old compound completely before installing fresh paste.

Recommendations

Use a moderate application amount suitable for your CPU/GPU package size and follow the cooler manufacturer's mounting procedure. Store the paste at room temperature away from direct sunlight and tightly close the container after use to maintain consistency. For critical cooling or overclocked systems, verify temperatures after installation to confirm proper thermal contact.