Zalman ZM-STC11 teplovodivá pasta, 2,0 g, sivá

For builders who want reliable heat transfer without exotic liquid metal risks, the Zalman ZM-STC11 delivers a straightforward metal-oxide paste in a precise syringe. Its 8.1 W/mK conductivity sits comfortably in the performance tier, enough for CPUs and GPUs without the electrical conductivity concerns of liquid metal alternatives.

Highlights

• 8.1 W/mK thermal conductivity
• Non-electrically conductive, non-corrosive formula
• No curing time required
• Odorless silicone-based compound
• 2.0 g syringe with precise application

In daily use

The ZM-STC11 spreads evenly and stays put, making it suitable for CPU, GPU, chipset, and heatsink mounting. Because it is electrically non-conductive, accidental contact with board traces is far less risky than with liquid metal products. The syringe format allows controlled dispensing, and the paste does not require curing, so systems can be powered on immediately after assembly.

Full specifications

• Product type: Thermal paste
• Thermal conductivity: 8.1 W/mK
• Net content weight: 2.0 g
• Colour: Gray
• Base material: Silicone-based
• Filler material: Metal oxide
• Electrically conductive: No
• Corrosive: No
• Curing: No
• Odor: Odorless
• Application method: Syringe
• Recommended application: CPU, GPU, chipsets, heatsinks

Final note

A dependable mid-range thermal paste for everyday builds and upgrades.