Akasa AK-TT300-01 tepelná podložka (balenie 2 ks) - 100x100x1,5 mm, 3,0 W/mK

The Akasa AK-TT300-01 is a high-quality thermal pad designed for efficient heat transfer between electronic components and heatsinks. This pack includes two pads, each measuring 100x100mm with a thickness of 1.5mm, providing a thermal conductivity of 3.0 W/mK. Ideal for CPUs, GPUs, chipsets, and power components, these non-adhesive, pressure-mounted pads offer reliable thermal management without the mess of thermal paste.

Advantages

Easy to install and reposition, these thermal pads eliminate the need for curing or cleaning. With a wide operating temperature range of -40°C to 180°C and UL 94 V-0 flame retardancy, they ensure safety and durability in demanding environments. The non-electrical conductive material prevents short circuits, making them suitable for sensitive electronics.

Suitable for

• CPUs and GPUs
• Chipsets and VRMs
• Power components and voltage regulators
• LED lighting and automotive electronics

Key specifications

• Thermal Conductivity: 3.0 W/mK
• Pad Dimensions: 100 x 100 x 1.5 mm (per pad)
• Quantity: 2 pads per pack
• Color: Grey
• Hardness: 60 Shore 00
• Specific Gravity: 2.6 g/cm³
• Volume Resistivity: 1.0 x 10^12 Ohm-cm
• Dielectric Constant: 5.0 @ 1MHz
• Dielectric Strength: 2.5 KV/mm
• Flame Retardancy: UL 94 V-0
• Operating Temperature: -40°C to 180°C

Recommendations

For optimal thermal performance, ensure surfaces are clean and dry before application. These pads are non-adhesive and rely on pressure for contact; use appropriate mounting pressure for best results. Suitable for applications where rework or repositioning is required.