Akasa T5 Pro-Grade+ teplovodivá pasta - 5,2 W/m·K - sivá - 0,04 °C/W - 2,6 g/cm³ - -50 až 250 °C

The Akasa T5 Pro-Grade+ is a high-performance silicone-based thermal paste designed for efficient heat transfer between CPUs, GPUs, chipsets, and power components. With a thermal conductivity of 5.2 W/m·K and low thermal resistance of 0.04 °C/W, it ensures optimal cooling for demanding applications. This non-electrical conductive, non-corrosive, and non-curing paste is safe and easy to apply using the included syringe. It operates reliably across a wide temperature range from -50 to 250 °C, making it suitable for both standard and extreme environments.

Advantages

Excellent thermal performance with 5.2 W/m·K conductivity and 0.04 °C/W resistance. Non-electrical conductive and non-corrosive, ensuring safe use on sensitive components. Non-curing formula allows for easy removal and reapplication. Wide operating temperature range from -50 to 250 °C. RoHS compliant and non-flammable for peace of mind.

Suitable for

• CPU and GPU cooling
• Chipsets and power components
• High-performance computing systems
• Overclocking and gaming rigs
• Industrial and embedded applications

Key specifications

• Thermal Conductivity: 5.2 W/m·K
• Thermal Resistance: 0.04 °C/W
• Color: Grey
• Density: 2.6 g/cm³
• Operating Temperature: -50 to 250 °C
• Net Weight: 3.5 g
• Application Method: Syringe
• Base Material: Silicone-based
• Dielectric Strength: > 5.0 kV/mm
• RoHS Compliant: Yes

Recommendations

For best results, clean the surfaces thoroughly before application. Apply a small pea-sized amount to the center of the CPU or GPU and let the cooler spread it evenly. Avoid using excessive paste to prevent spillage and reduced performance.