Akasa AK-TT300-02 tepelná podložka (balenie 2 ks) - 100x100x1,5 mm, 3,0 W/mK, modrá

The Akasa AK-TT300-02 is a high-performance thermal pad designed for efficient heat transfer between electronic components and heatsinks. With a thermal conductivity of 3.0 W/mK and a soft, conformable silicone material, it provides reliable thermal management for CPUs, GPUs, chipsets, VRMs, SSDs, and memory modules. This pack contains two pads, each measuring 100 x 100 x 1.5 mm, making them suitable for a wide range of applications.

Advantages

Non-adhesive yet inherently tacky for easy placement and repositioning. Electrically non-conductive, ensuring safe use around sensitive circuits. Wide operating temperature range from -40°C to 180°C. UL 94 V-0 flammability rating for enhanced safety. RoHS compliant for environmental responsibility.

Suitable for

• CPU and GPU cooling
• Chipset and VRM heat dissipation
• SSD and memory module thermal management
• Any electronic component requiring gap filling and heat transfer

Key specifications

• Product Type: Thermal Pad
• Thermal Conductivity: 3.0 W/mK
• Pad Dimensions (each): 100 x 100 x 1.5 mm (L x W x H)
• Quantity per Pack: 2 pads
• Color: Blue
• Material: Silicone-based
• Operating Temperature Range: -40°C to 180°C
• Hardness: 25 Shore 00
• Density: 2.6 g/cm³
• Electrical Conductivity: Non-electrical conductive
• Flammability Rating: UL 94 V-0
• Adhesive Properties: Non-adhesive (inherently tacky)
• RoHS Compliance: Yes

Recommendations

For optimal thermal performance, ensure surfaces are clean and dry before application. The pad can be cut to size if needed. Ideal for DIY builders, system integrators, and repair technicians.