Alphacool Rise Ultra Soft tepelná podložka 7W/mK 100x100x1mm - sivá 13012

PC builders and overclockers often face the challenge of uneven surfaces on CPUs, GPUs, and memory modules, where traditional thermal paste can be messy or inconsistent. The Alphacool Rise Ultra Soft Thermal Pad offers a clean, reusable alternative, delivering a reliable 7 W/m·K thermal conductivity in a convenient 100 x 100 x 1 mm sheet. Its ultra-soft silicone formulation conforms perfectly to microscopic irregularities, ensuring maximum heat transfer without the risk of electrical shorts thanks to its 5500 V dielectric breakdown strength.

Key specifications

• Thermal conductivity: 7 W/m·K
• Dimensions: 100 mm length x 100 mm width x 1 mm thickness
• Colour: Grey
• Material: Silicone-based, electrically insulating
• Operating temperature range: -40 °C to 160 °C
• Dielectric breakdown voltage: 5500 V
• Non-adhesive, ultra-soft and flexible

Why choose it

This pad eliminates the mess of thermal paste and can be cut to any size for a perfect fit on various components. Its ultra-soft nature allows it to fill gaps effectively, reducing thermal resistance and improving cooling performance. The high dielectric strength protects your hardware from electrical damage, making it safe for use on exposed circuitry. Plus, it is reusable and easy to handle, saving time during installation and maintenance.

Ideal use cases

• Cooling CPUs and GPUs in custom water cooling loops or air coolers
• Thermal interface for VRM, chipsets, and memory modules
• Filling uneven gaps on heat sinks and heat spreaders
• Industrial and electronics applications requiring electrical insulation

Good to know

The pad is non-adhesive, so it stays in place by compression between the component and cooler. For best results, ensure both surfaces are clean and dry before application. One 100 x 100 mm sheet provides enough material for multiple applications, and the pad can be stored for future use without degradation.