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Teplovodivá pasta Kolink UMBRA Pro TP-1 30 g High Performance

Teplovodivá pasta Kolink UMBRA Pro TP-1 30 g High Performance
Teplovodivá pasta Kolink UMBRA Pro TP-1 30 g High Performance
Teplovodivá pasta Kolink UMBRA Pro TP-1 30 g High Performance
Teplovodivá pasta Kolink UMBRA Pro TP-1 30 g High Performance
Teplovodivá pasta Kolink UMBRA Pro TP-1 30 g High Performance
Teplovodivá pasta Kolink UMBRA Pro TP-1 30 g High Performance
9,94 €
Kolink UMBRA Pro TP-1 30 g High Performance thermal paste is formulated to improve heat conduction between processors, graphics chips and their cooling solutions. Supplied in a squeezable tube for controlled dispensing, this thermal compound fills microscopic gaps on surfaces to reduce thermal resis... Čítať viac
Sklad 50 Kód 309567 Značka KOLINK Model KL-CPX-30 Záruka 2 roky

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Kolink UMBRA Pro TP-1 30 g High Performance thermal paste is formulated to improve heat conduction between processors, graphics chips and their cooling solutions. Supplied in a squeezable tube for controlled dispensing, this thermal compound fills microscopic gaps on surfaces to reduce thermal resistance and support lower operating temperatures in desktops, gaming systems and workstations. The 30 g volume is suitable for multiple applications or for servicing larger cooling assemblies.

Advantages

The compound offers high thermal conductivity and stable viscosity, enabling consistent spread and long-term thermal contact. Its non-electrically conductive composition reduces the risk of short circuits during application. The tube packaging enables precise application and minimizes waste. Overall, the formulation is designed to provide improved heat transfer and sustained thermal performance under continuous load.

Suitable for

  • Replacing or refreshing thermal interface material on CPUs and GPUs
  • Building or maintaining gaming PCs and high-performance desktops
  • Cooling upgrades in workstations and content-creation rigs
  • Servicing large coolers, liquid-cooling blocks and multi-socket systems

Key specifications

  • Net weight: 30 g
  • Form: viscous paste in squeeze tube
  • Thermal interface type: high-performance thermal compound
  • Electrical properties: non-conductive (non-electrically conductive)
  • Compatibility: suitable for use between metal CPU/GPU heat spreaders and heatsinks or cold plates

How to use

Clean both mating surfaces thoroughly with isopropyl alcohol and a lint-free cloth to remove old compound and contaminants. Apply a pea-sized or thin line amount of Kolink UMBRA Pro TP-1 to the center of the processor heat spreader, or follow the manufacturer-recommended pattern for your cooler. Mount the heatsink or cooling block evenly and secure according to the cooler instructions to spread the paste and create uniform contact. If reapplying, remove old paste completely before applying a fresh layer.

Recommendations

Use gloves or avoid direct skin contact; store the tube in a cool, dry place away from direct sunlight. For best thermal performance, apply a minimal, even layer and avoid excessive paste that can act as an insulator. Replace thermal paste during periodic maintenance or when temperatures rise above normal operating levels.

Hlavné vlastnosti
  • Replacing or refreshing thermal interface material on CPUs and GPUs
  • Building or maintaining gaming PCs and high-performance desktops
  • Cooling upgrades in workstations and content-creation rigs
  • Servicing large coolers, liquid-cooling blocks and multi-socket systems
  • Net weight: 30 g
  • Form: viscous paste in squeeze tube
  • Thermal interface type: high-performance thermal compound
  • Electrical properties: non-conductive (non-electrically conductive)
  • Compatibility: suitable for use between metal CPU/GPU heat spreaders and heatsinks or cold plates
Vývoj ceny za posledných 6 mesiacov
Teplovodivá pasta Kolink UMBRA Pro TP-1 30 g High Performance
Aktuálna
9,94 €
Najnižšia
9,34 €
Najvyššia
44,28 €
Zmena za 24 h
+0,59 €   +6%
Týždeň
+0,57 €   +6%
Mesiac
+0,59 €   +6%

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