Teplovodivá pasta Thermal Grizzly Hydronaut 26 g

Thermal Grizzly Hydronaut 26 g is a high-performance thermal compound designed primarily for medium- to large-scale cooling solutions such as custom water-cooling loops. With a thermal conductivity of 11.8 W/m·K and a density of 2.6 g/cm³, Hydronaut provides efficient heat transfer between high-performance CPUs, GPUs and larger heat spreaders while remaining silicone-free and non-conductive.

Advantages

Hydronaut offers excellent thermal conductivity without electrical conductivity and does not require curing. Its silicone-free composition makes the paste light, flexible and easy to apply. The product is suitable for overclocking scenarios and is ROHS-compliant, delivering a balanced price-performance ratio for users who run extensive cooling setups.

Suitable for

• Custom water cooling loops
• High-performance CPUs and GPUs
• Overclocked systems and demanding thermal loads
• Large heat spreaders and multi-component cooling assemblies

Key specifications

• Thermal conductivity: 11.8 W/m·K
• Weight: 26 g (0.026 kg)
• Density: 2.6 g/cm³
• Operating temperature range: -200 to 350 °C
• Silicone-free; non-electrically conductive; no curing required
• Brand: Thermal Grizzly, MPN: TG-H-100-R, EAN: 0753677507555

How to use

Prepare mating surfaces by cleaning them thoroughly of old thermal paste, dust and oils. Apply a pea-sized or line amount of Hydronaut to the center of the chip, depending on the size of the heat source, and mount the cooler using even pressure to spread the compound. For large spreaders or water blocks, adjust the amount to ensure full contact without excessive overflow. Reapply paste when removing or reseating the cooler.

Recommendations

Do not use Hydronaut on live electrical contacts. Although non-electrically conductive, avoid contaminating sockets or PCB traces. The product is compatible with aluminum; the warning about aluminum compatibility applies only to Conductonaut products. Store the tube in a cool, dry place and follow normal ESD and installation precautions when assembling components.