Teplovodivá pasta Kolink UMBRA PRO TP-1, 6 g tuba, vysoko vodivé spojenie CPU/GPU

Kolink UMBRA PRO TP-1 is a high-conductivity thermal compound supplied in a 6 g squeezable tube, developed to improve heat transfer between CPUs or GPUs and their cooling solutions. The paste fills microscopic surface irregularities on heat spreaders and cooler bases to create a consistent thermal interface that reduces operating temperatures and supports stable performance under load. The 6 g format is suitable for multiple applications or targeted single installations during system builds and component maintenance.

Advantages

UMBRA PRO TP-1 offers a balance of thermal conductivity and ease of application, enabling efficient heat dissipation while remaining easy to spread or dispense directly from the tube. The compound is formulated to remain stable over time, resisting separation and drying that can degrade thermal performance. Its neutral electrical properties and non-corrosive composition reduce the risk of short circuits or damage to surrounding components when applied correctly.

Suitable for

• Applying between CPU or GPU heat spreader and air or liquid cooler
• System assembly and upgrades in desktop PCs
• Maintenance and thermal rework of cooling systems
• Small-scale repairs where controlled paste volume is needed

Key specifications

• Net weight: 6 g tube
• Form: viscous thermal compound suitable for syringe/tube application
• Compatibility: designed for CPUs and GPUs as a TIM (thermal interface material)
• Application temperature range: suitable for typical consumer and enthusiast CPU/GPU operating temperatures
• Electrical properties: formulated to be non-conductive or electrically neutral under normal conditions

How to use

Clean both the processor heat spreader and the cooler base with isopropyl alcohol and a lint-free cloth to remove old compound and contaminants. Apply a pea-sized amount or a thin line of Kolink UMBRA PRO TP-1 to the center of the processor surface, then install the cooler according to the manufacturer’s mounting instructions to spread the paste evenly. For larger heat spreaders, a cross or line application may be preferred; avoid excessive amounts to prevent overflow onto the motherboard. If reapplying, remove old paste residue completely before adding fresh compound.

Recommendations

Store the tube in a cool, dry place away from direct sunlight. Use gloves or avoid skin contact if desired and ensure even pressure and correct mounting sequence when seating the cooler. For best thermal results, follow the cooler manufacturer’s torque and mounting guidance and inspect thermal performance after the first boot under load.